data sheet semiconductor http://www.yeashin.com 1 rev.03 20140320 YSESDAXXCP h applications cell phone handsets and accessories microprocessor based equipment personal digital assistants (pda?s) notebooks, desktops, and servers portable instrumentation peripherals pagers iec compatibility iec61000-4-2 (esd) 30kv (air), 30kv (contact) iec61000-4-4 (eft) 40a (5/50 s) features 100 watts peak pulse power per line (tp=8/20 s) protects one bidirectional i/o line low clamping voltage working voltages : 3.3v, 5v and 8v low leakage current mechanical characteristics dfn1006 (1.0x0.6x0.5mm) package molding compound flammability rating : ul 94v-o weight 0.5 millgrams (approximate) quantity per reel : 10,000pcs reel size : 7 inch lead finish : lead free bidirectional tvs diode dfn1006 pin configuration
http://www.yeashin.com 2 rev.03 20140320 YSESDAXXCP device characteristics (v) (v) @1a ( a) (pf) (max.) (min.) (ma) (max.) (max.) (@a) (max.) (typ.) 7 ysesda08cp n 8 8.5 1 17.5 25 4 1 t stg -55 ~ 150 v c electrical characteristics per line (@ 25 unless otherwise specified) peak pulse power (tp=8/20s waveform) t j 10 ysesda05cp m 5 6 1 9.8 20 symbol value units -55 ~ 150 maximum ratings (@ 25 unless otherwise specified) 260 (10 sec.) watts 100 p pp t l parameter part number device marking v rwm lead soldering temperature storage temperature range 7 12 8 1 10 ysesda33cp 5 1 i r c t operating temperature range t 3.3 3.5 1 v c i t v b
http://www.yeashin.com 3 rev.03 20140320 YSESDAXXCP package outline & dimensions * soldering footprint dnf1006
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